This 0.08in thick Gap Pad 3000S30 soft gap-filling material from Bergquist Features high thermal performance and electrical isolation at a low mounting pressure. Having inherent tackiness on both sides of the material, as well as fibreglass carrier reinforcement, enhances material handling, puncture, shear and tear resistance.
This material has been designed for high performance, low-stress applications as a replacement for standoff or clip-mounting thermal devices. Having a soft and conformable yet elastic nature ensures that, with its excellent wet-out and interfacing characteristics, an efficient thermal interface is achieved.
Suitable applications for include processors, server S-RAMs, mass storage devices, BGA packages, notebook computers, power conversion and wireless communications hardware.
- Dimensions 4 x 4in
- Light blue colour
- 3W/m-K thermal conductivity
- Operating temperature -60°C to +200°C
- 3000V AC breakdown voltage
- Low modulus polymer/fibreglass material
- Rated to UL 94V-0
| Breakdown Voltage |
3000V |
| Material |
Low modulus polymer / fiberglass |
| Package/Case |
BGA |
| Temperature Range |
-60 to +200°C |
| Thermal Conductivity |
3W/m-K |
